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Home | Research | Research Programs | 3D Technologies |
3D TechnologiesVLSI CMOS SensorsThe Visual Information Technology group (VIT) of NRC-IIT conducts ongoing work in developing technology that advances the field of visual information. The VLSI-CMOS sensor project develops new digital 3D imaging technology for measuring the position of a laser beam in the process of capturing a 3D surface map. Prototypes developed for this project combine:
The miniaturization made possible by VLSI technology allows for systems with increased performance, accessibility, and, lower maintenance, size and cost. This project aims to design optimized position sensors that are based on commercial silicon technology. Current position sensors are not appropriate and cost effective for high-resolution laser scanners used in digital 3D imaging. They are intended for 2D imaging applications in other fields, and their specifications change according to the evolution of their respective fields and not to the requirements of digital 3D imaging. Combined capabilities of hybrid prototype solutionsThe two prototypes developed are for position sensitive detectors, or position sensors (PS), that are used to detect angles when a laser spot is scanned onto a surface and measured using optical triangulation. Two main types of sensors are generally used to accomplish position detection, one type noted for its accuracy and the other for its high measurement speed.
The project’s prototypes are hybrid solutions that will be an integral part of future intelligent digitizers able to measure registered color (reflectance) and 3D coordinates both accurately and at a high data rate. The first prototype, the Colorange sensor, uses continuous response position sensors (CRPS). The second and preferred prototype, the ColorSens sensor, uses discrete response position sensors (DRPS).
While CRPS provides speed, project researchers found a way to increase performance using the more accurate DRPS by doubling the DRPS sensors on the same chip, with each sensor filling a different function. The first sensor calculates a raw estimate of the spot position, while the second sensor calculates the spot position with higher accuracy on the basis of information passed on by the first DRPS. Using two of the same type of sensors means that they are suitable for integration on the same chip using the same process. This greatly reduces production and alignment costs. Advantages of using commercial silicon technologyUsing commercial silicon technology in the next stage of development of optical sensors for 3D imaging technology takes advantage of current opportunities in the field:
Integration of most low level processing steps on a chip using advances in VLSI CMOS will allow digital 3D imaging technology to become widely accepted and accessible to universities, research labs, industries, and individual use in such fields as visual communication, heritage documentation, and industrial automation. This research project is conducted in collaboration with the Istituto per la Ricerca Scientifica e Technologica of Trento, Italy, ITC-Irst, as part of their Integrated optical sensors project. Related NRC-IIT PublicationsResearch ContactJean-Angelo Beraldin (Angelo) Business ContactCharles Gauthier |
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